Intel
DescriptionIntel
PackageTray
Stock6000
PriceActive
DownloadThe 1SX250HH2F55E2LG is a high-performance FPGA (Field Programmable Gate Array) from Intel’s Stratix® 10 family, designed for applications that demand extreme data throughput, low latency, and high computational performance. Built on Intel’s HyperFlex™ architecture, this FPGA offers advanced features like high-speed transceivers, integrated HBM memory, and superior energy efficiency. It is ideal for industries like data centers, networking, military, and aerospace where high-level performance, adaptability, and scalability are critical.
HyperFlex™ Architecture: Enables high-speed data processing and low-latency applications, delivering superior performance.
Integrated High Bandwidth Memory (HBM): Enhances system memory bandwidth, reducing bottlenecks and ensuring high data throughput.
High-Performance Transceivers: Supports high-speed serial interfaces, making it ideal for networking and data communication applications.
Energy Efficiency: Designed to deliver optimal performance with lower power consumption, making it suitable for energy-sensitive applications.
Scalability and Flexibility: Offers customization options to suit a wide range of complex designs across industries like AI, communications, and military applications.
Parameter | Value |
---|---|
Category | Embedded - FPGAs (Field Programmable Gate Array) |
Architecture | Stratix® 10 |
Logic Elements | 2,500,000 |
Transceiver Speed | Up to 58 Gbps |
Memory | Integrated HBM (High Bandwidth Memory) |
Operating Temperature | 0°C to 100°C |
Supply Voltage | 0.85V |
Number of I/Os | 3,840 |
Package | FC-BGA-2397 |
Clock Speed | Up to 1.5 GHz |
Power Consumption | Low-power optimized |
ECC Support | Yes |
Security Features | Hardware-based security features |
The 1SX250HH2F55E2LG FPGA is suitable for a variety of high-performance applications, including:
Data Center Acceleration: Optimized for high-throughput computing tasks like real-time analytics, data processing, and machine learning algorithms in cloud environments.
Networking and Communications: Ideal for 5G infrastructure, routers, and switches, where high-speed data transfer and low latency are essential.
Military and Aerospace: Used in radar systems, secure communications, and avionics, where reliability, performance, and security are key factors.
Artificial Intelligence (AI): Supports AI accelerators for deep learning inference and training, ensuring fast processing of large datasets.
Medical Imaging: Powers advanced imaging systems requiring high-resolution data processing, such as MRI and CT scanners.
In data centers, the 1SX250HH2F55E2LG is deployed in servers for real-time analytics, improving performance in tasks such as machine learning and video transcoding. In 5G networks, it is used in base stations and backhaul infrastructure, enabling fast, low-latency communication. In the military, this FPGA supports mission-critical operations like encrypted communications and radar signal processing, delivering unmatched reliability and performance under extreme conditions.
DHL Express: Offers fast and reliable delivery (3-5 business days), ideal for time-sensitive shipments of high-value electronic components.
FedEx International Priority: Provides similar shipping speeds to DHL, with a focus on timely and secure international delivery, perfect for urgent deliveries.
UPS Worldwide Express: Provides 2-5 business days delivery, known for its reliability and comprehensive tracking options, making it suitable for high-value components.
TNT Express: A cost-effective choice for bulk shipments where delivery speed is less critical, often chosen for larger orders of electronic components.
Q1: What is the logic capacity of the 1SX250HH2F55E2LG?
A1: The FPGA features 2.5 million logic elements, offering high flexibility for complex designs.
Q2: Is the 1SX250HH2F55E2LG suitable for AI applications?
A2: Yes, it is optimized for AI accelerators, providing fast data processing for deep learning inference and training tasks.
Q3: What package type does this FPGA come in?
A3: The FPGA is available in a 2397-ball FC-BGA package, ensuring a compact design with high pin density.
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