1SX280HH3F55E2LGS3

1SX280HH3F55E2LGS3
Manufacturer

Intel

Description

Intel

Package

Tray

Stock

4000

Price

Active

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1SX280HH3F55E2LGS3.pdf

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Product Attributes

1SX280HH3F55E2LGS3 Product Details

Product Overview

The 1SX280HH3F55E2LGS3 is a high-performance FPGA (Field-Programmable Gate Array) from Intel's Stratix 10 family, designed for applications requiring extensive processing power and scalability. Built using Intel's HyperFlex architecture, this FPGA offers exceptional speed, energy efficiency, and flexibility. It incorporates up to 280,000 Adaptive Logic Modules (ALMs) and delivers optimal performance for data-intensive workloads such as artificial intelligence, machine learning, and high-performance computing (HPC). The 1SX280HH3F55E2LGS3 ensures seamless integration with modern data center systems, making it an excellent choice for complex embedded applications.

Key Features and Advantages

  • HyperFlex Architecture: Provides enhanced clock speeds and superior performance through improved pipelining and re-timing capabilities.

  • High Logic Density: Up to 280,000 ALMs, providing a powerful solution for demanding computational tasks.

  • Advanced Memory Support: Supports high-bandwidth memory (HBM2) and DDR4 for optimal data throughput in bandwidth-hungry applications.

  • Integrated DSP Blocks: Enables efficient handling of complex mathematical functions, crucial for AI and machine learning applications.

  • Low Power Consumption: Designed to deliver high performance while maintaining low power usage, ideal for energy-sensitive environments.

Specifications

ParameterValue
Logic Elements (LEs)280,000 ALMs
MemoryHBM2, DDR4 support
DSP Blocks5,760 DSP blocks
Operating Voltage0.85V – 1.1V
InterfacePCIe Gen4, 100G Ethernet
PackageF55
Operating Temperature-40°C to +100°C
CategoryEmbedded – FPGA

Applications

The 1SX280HH3F55E2LGS3 FPGA is highly versatile and is used in advanced computational and embedded systems, including:

  • Data Centers: Enhances AI workloads and machine learning models with accelerated computing performance.

  • High-Performance Computing (HPC): Supports complex simulations, including scientific research, weather forecasting, and financial modeling.

  • Telecommunications: Powers 5G networks and infrastructure with its robust processing capabilities, managing high bandwidth and low-latency demands.

  • Autonomous Systems: Crucial for real-time processing in autonomous driving platforms, robotics, and UAVs, where low latency and fast decision-making are essential.

  • Military and Aerospace: Provides scalable and reliable performance for mission-critical systems requiring ruggedized, high-speed data processing.


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Usage Scenarios

In data centers, the 1SX280HH3F55E2LGS3 is ideal for accelerating AI and machine learning tasks, processing large datasets and running complex algorithms with low latency. In 5G telecommunication networks, it handles high bandwidth and low-latency processing, enabling fast data transmission and improving network efficiency. In autonomous systems, it processes real-time data inputs from sensors, cameras, and other devices, making it ideal for applications like self-driving cars and unmanned aerial vehicles (UAVs), where speed and reliability are paramount.

Shipping and Transportation Methods

Common international shipping methods for semiconductor products include:

  • DHL Express: Known for its speed, DHL Express delivers globally within 3-5 business days, ideal for urgent orders.

  • FedEx International Priority: Offers similar fast delivery with tracking options, suitable for time-sensitive and valuable shipments.

  • UPS Worldwide Express: Provides reliable delivery within 2-5 business days and extensive tracking, preferred for high-value shipments.

  • TNT Express: Known for cost-effective shipping, often used for bulkier shipments with slightly longer delivery times than DHL or FedEx.

For high-value components like the 1SX280HH3F55E2LGS3, DHL and FedEx are often chosen for faster and secure shipping options, while TNT may be preferred for larger, less time-sensitive orders.

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FAQs

Q1: What is the primary advantage of using the 1SX280HH3F55E2LGS3 in AI applications?
A1: The 1SX280HH3F55E2LGS3 provides enhanced processing power with integrated DSP blocks, making it ideal for high-performance machine learning and AI workloads.

Q2: Does this FPGA support high-speed memory interfaces?
A2: Yes, it supports high-bandwidth memory (HBM2) and DDR4, ensuring optimal data throughput for memory-intensive applications.

Q3: What industries benefit most from the 1SX280HH3F55E2LGS3?
A3: Industries such as telecommunications, data centers, aerospace, military, and autonomous systems benefit from the performance, flexibility, and scalability of this FPGA.


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