1SX210HU3F50I3VG

Manufacturer

Intel

Description

Intel

Package

Tray

Stock

6000

Price

Active

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1SX210HU3F50I3VG.pdf

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Product Attributes

1SX210HU3F50I3VG Product Details

Product Overview

The 1SX210HU3F50I3VG is a high-performance FPGA from Intel's Stratix 10 family, designed for advanced computing applications. This device is ideal for applications that require high processing power, such as data centers, AI accelerators, and high-frequency trading systems. Featuring advanced transceiver technology, high-density logic, and integrated memory, the 1SX210HU3F50I3VG delivers exceptional performance while maintaining power efficiency. Its 14 nm Tri-Gate process technology ensures superior signal integrity and optimized speed.

Key Features and Advantages

  • High Performance: Equipped with advanced architecture and transceiver technology for demanding high-speed applications.

  • Large Logic Density: Provides high logic element count for complex computations and data processing tasks.

  • Energy Efficient: Optimized for power-efficient performance without compromising processing speed.

  • Integrated Memory: Features embedded memory blocks to enhance data storage and retrieval speeds.

  • Advanced Process Technology: Built on Intel’s 14 nm Tri-Gate process technology, ensuring high performance and low power consumption.

  • Customizable Configurations: Supports flexible system designs for a range of applications, including data center acceleration and communications infrastructure.

Specifications

ParameterValue
CategoryEmbedded - FPGAs
FamilyStratix 10
Number of Logic Elements2,100,000
Transceiver Count96
Transceiver SpeedUp to 28.3 Gbps
Operating Temperature-40°C to +100°C
Process Technology14 nm Tri-Gate
Embedded Memory229 Mbits
DSP Blocks5,760
I/O Pins1,688
Core Voltage0.85V
PackageFCBGA-2397
Mounting TypeSurface Mount

Application Areas

  • Data Centers: The 1SX210HU3F50I3VG can be used to accelerate data center workloads, including deep learning, data analytics, and high-performance computing, where high processing power and efficient data transfer are essential.

  • Telecommunications Infrastructure: Ideal for use in 5G base stations and networking equipment that require low-latency, high-bandwidth connections.

  • Financial Services: Perfect for high-frequency trading systems where ultra-low latency and rapid computation are critical for transaction processing.

  • Aerospace and Defense: Provides robust processing power for real-time analytics and sensor data processing in satellite and defense systems.

  • Artificial Intelligence (AI) and Machine Learning (ML): Suitable for AI accelerators that require fast processing and data manipulation for training and inference models.


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Usage Scenarios

  • Cloud Computing: In cloud infrastructure, the 1SX210HU3F50I3VG enables faster processing of data-intensive tasks, such as big data analytics, real-time processing, and machine learning model execution.

  • 5G Networks: With its high transceiver speed and bandwidth, it plays a pivotal role in 5G base stations, enabling high-speed, reliable communications.

  • High-Frequency Trading: The ultra-low latency capabilities make it suitable for financial systems where rapid transactions and decision-making are vital.

  • Autonomous Systems: Used in autonomous vehicles and drones for real-time decision-making and data processing, ensuring safe and efficient operation.

Shipping and Transportation Methods

  • DHL Express: DHL offers fast and reliable international shipping with delivery within 1-3 business days, ideal for urgent and high-value shipments. It includes full tracking and expedited customs clearance.

  • FedEx International Priority: FedEx delivers within 1-3 business days with comprehensive tracking and reliable customer service, suitable for time-sensitive shipments.

  • UPS Worldwide Express: Offers delivery in 1-3 business days, with strong tracking capabilities and efficient handling of international shipments.

  • TNT Express: Typically used for heavier or bulkier shipments, TNT delivers within 3-6 business days, commonly chosen for larger industrial orders.

  • EMS (Express Mail Service): A more cost-effective solution for less time-sensitive shipments, with delivery times ranging from 5-10 business days. Suitable for smaller, less urgent packages.


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Frequently Asked Questions (FAQs)

Q1: What is the maximum transceiver speed for the 1SX210HU3F50I3VG?
The 1SX210HU3F50I3VG features transceivers that support speeds up to 28.3 Gbps, making it ideal for high-bandwidth applications.

Q2: What is the operating temperature range of this device?
The 1SX210HU3F50I3VG operates within a temperature range of -40°C to +100°C, ensuring reliable performance in harsh environments.

Q3: How much embedded memory does the 1SX210HU3F50I3VG offer?
This FPGA includes 229 Mbits of embedded memory, suitable for fast data storage and retrieval in processing-intensive applications.

Q4: Is the 1SX210HU3F50I3VG suitable for AI applications?
Yes, the high logic density and DSP blocks make it ideal for artificial intelligence and machine learning accelerators, particularly for deep learning tasks.

Q5: What is the package type of the 1SX210HU3F50I3VG?
The device comes in an FCBGA-2397 package, which is a surface-mount type suitable for high-performance applications requiring efficient heat dissipation.


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