1SX250HH3F55E3VG

1SX250HH3F55E3VG
Manufacturer

Intel

Description

Intel

Package

Tray

Stock

6000

Price

Active

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Product Attributes

1SX250HH3F55E3VG Product Details

Product Overview

The 1SX250HH3F55E3VG is a cutting-edge embedded device from Intel’s Stratix 10 SX family, designed to deliver unparalleled performance, scalability, and energy efficiency. Utilizing Intel's HyperFlex FPGA architecture, it offers high bandwidth and low-latency communication, ideal for data-intensive applications in computing, networking, and storage. This model supports up to 2.5 million logic elements, with integrated ARM Cortex-A53 processors, enabling users to handle complex workloads in real-time. The device is optimized for AI, high-performance computing (HPC), and large-scale data processing tasks, making it highly suitable for enterprise-level deployments.

Key Features and Advantages

  • High Performance: The device supports up to 2.5 million logic elements, ensuring it can handle the most demanding computational workloads.

  • Integrated ARM Processors: With integrated ARM Cortex-A53 processors, this model combines FPGA flexibility with traditional processing power, enhancing system-level performance.

  • HyperFlex Architecture: Intel's HyperFlex architecture delivers significant performance improvements by enabling more efficient routing and clocking.

  • High-Speed Transceivers: Equipped with high-speed transceivers for fast data throughput, ideal for networking and communication applications.

  • Energy Efficiency: Designed to optimize power usage without compromising on performance, making it ideal for large-scale deployments.

  • Advanced Security Features: Built-in security features ensure data integrity and system protection, meeting the demands of secure networked systems.

Specifications

ParameterValue
CategoryEmbedded - FPGAs (Field-Programmable Gate Arrays)
Logic Elements2.5 Million
Embedded ARM Processors4x ARM Cortex-A53
DSP Blocks6,840
Memory10.6 Mbits of M20K memory
High-Speed TransceiversUp to 64 lanes at 28.3 Gbps
Operating FrequencyUp to 1.5 GHz
Power ConsumptionOptimized for low-power operation
Operating Temperature Range-40°C to +100°C
Security FeaturesAES encryption, anti-tamper protection
PackageBGA-55
Mounting TypeSurface Mount (SMT)

Application Areas

  • Artificial Intelligence (AI) & Machine Learning: The 1SX250HH3F55E3VG is ideal for AI accelerators, deep learning platforms, and neural network processing, as it provides high performance with low latency for complex data processing.

  • High-Performance Computing (HPC): The device's high computational capabilities and large memory make it suitable for HPC environments, such as simulations, modeling, and big data analytics.

  • 5G Infrastructure: In telecommunications, this FPGA model supports the high data rates and processing power needed for 5G base stations, network infrastructure, and edge computing.

  • Data Centers & Cloud Computing: It is highly suitable for use in data centers to accelerate compute-intensive tasks such as video encoding/decoding, cryptography, and high-frequency trading.

  • Medical Imaging & Industrial Automation: Its ability to process high-resolution data in real-time makes it ideal for medical imaging systems and automated industrial solutions like robotics and predictive maintenance.


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Usage Scenarios

  • Telecom Networks: In 5G cellular networks, the 1SX250HH3F55E3VG can be used to process and manage high-bandwidth data streams between base stations and user devices, ensuring low latency and high efficiency.

  • Data Center Acceleration: Used in cloud data centers, this device accelerates tasks such as encryption/decryption, data compression, and real-time analytics, providing faster data processing at reduced costs.

  • Automated Industrial Systems: In industrial automation, the FPGA helps power real-time control systems for robotics, machine vision, and sensor data aggregation.

  • AI and Deep Learning Applications: The FPGA’s parallel processing capability is leveraged in AI platforms to accelerate deep learning models, enabling faster decision-making in applications such as autonomous vehicles and smart cities.

Shipping and Transportation Methods

  • DHL Express: A reliable and fast shipping option, offering door-to-door delivery within 1-3 business days internationally. Known for excellent tracking services and premium logistics management, DHL Express is widely used for high-priority shipments.

  • FedEx International Priority: This method ensures delivery within 1-3 business days for time-sensitive items, featuring advanced tracking and customer service. FedEx also offers competitive pricing for both small and bulk shipments.

  • UPS Worldwide Expedited: Provides reliable shipping with delivery times ranging from 2-5 business days, suitable for medium-priority shipments. UPS also offers great tracking features and logistical support.

  • TNT Express: Known for economical rates, TNT Express provides delivery within 3-6 business days, making it an ideal choice for non-urgent shipments.

  • EMS (Express Mail Service): A cost-effective postal service that generally takes 5-10 business days for delivery. EMS is suitable for non-urgent packages, though it may not offer the level of tracking precision found with premium couriers.


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Frequently Asked Questions (FAQs)

Q1: What is the logic element capacity of the 1SX250HH3F55E3VG?
The device supports up to 2.5 million logic elements, enabling it to handle complex computational tasks and data-intensive workloads.

Q2: Can the 1SX250HH3F55E3VG be used for AI applications?
Yes, its high processing power, integrated ARM processors, and parallel computing capabilities make it ideal for AI and machine learning applications, including real-time inference and neural network processing.

Q3: What are the key security features of this FPGA?
The 1SX250HH3F55E3VG includes AES encryption, anti-tamper protection, and other security measures to ensure data integrity and protect against unauthorized access.

Q4: Is the 1SX250HH3F55E3VG suitable for 5G infrastructure?
Yes, the device's high-speed transceivers and low-latency processing capabilities make it an excellent choice for 5G infrastructure, including base stations and network edge computing.


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