Intel
DescriptionIntel
PackageTray
Stock6000
PriceActive
DownloadThe 1SX280HN2F43E2LG is a high-performance FPGA from Intel's Stratix 10 series, built on 14nm FinFET technology. This FPGA is designed for demanding applications that require high compute density, low power consumption, and scalability. Leveraging Intel’s HyperFlex architecture, it delivers unparalleled system-level performance for use in industries such as telecommunications, data centers, artificial intelligence (AI), and high-performance computing (HPC). With advanced processing capabilities and integrated HBM2 memory, it enables efficient handling of large datasets and complex algorithms.
HyperFlex Architecture: Enhances core performance with increased flexibility in clocking and data processing.
14nm FinFET Technology: Provides a balance of high performance and low power consumption, ideal for power-sensitive applications.
High Compute Capacity: Supports large-scale integration, making it suitable for data-heavy workloads.
Integrated HBM2 Memory: Delivers faster memory access, enhancing throughput in AI/ML applications and HPC.
Security Features: Offers robust encryption and authentication to ensure data integrity and protection.
Parameter | Value |
---|---|
Category | Embedded - FPGAs (Field Programmable Gate Arrays) |
Technology | 14nm FinFET |
Logic Elements | 2.8 million |
Embedded Memory | 229 Mb |
DSP Blocks | 5,760 |
Transceiver Count | 96 |
Operating Voltage | 0.85V - 0.9V |
Maximum Frequency | 1 GHz |
Interface | PCIe Gen3/4, HBM2, Ethernet, DDR4 |
Package Type | FCBGA (Flip Chip Ball Grid Array) |
Package Size | 43mm x 43mm |
Temperature Range | -40°C to +100°C |
Power Consumption | Application-dependent, typically 14.5W - 40W |
The 1SX280HN2F43E2LG FPGA is highly suited for advanced technological applications, including:
Telecommunications: Ideal for 5G base stations and network equipment requiring high bandwidth and low latency.
Data Centers: Optimizes server workloads for cloud computing, big data processing, and real-time analytics.
AI and Machine Learning: Accelerates AI model training and inference processes with its high DSP count and HBM2 memory.
Autonomous Systems: Utilized in autonomous vehicles and robotics for real-time decision-making and data processing.
High-Performance Computing (HPC): Used in supercomputers to handle large-scale simulations, scientific calculations, and data analysis.
Cloud Service Providers: This FPGA supports high-volume data processing, making it ideal for cloud providers needing to scale operations efficiently.
AI/ML Frameworks: Facilitates faster inference in AI models, allowing industries such as healthcare, finance, and retail to implement real-time AI solutions.
Telecom Infrastructure: Ensures high throughput and minimal latency in networking environments, such as 5G infrastructure and high-speed communication systems.
Data Analytics: In financial services and cybersecurity, it supports real-time data analysis and large-scale computation tasks.
DHL Express: Offers reliable and fast international delivery, making it ideal for high-priority, time-sensitive shipments.
FedEx International Priority: Provides quick transit times and excellent tracking services, suitable for high-value components.
UPS Worldwide Express: A cost-effective option for rapid delivery while maintaining tracking capabilities for business-to-business transactions.
TNT Express: Suitable for economical international shipping, providing reliable service without compromising delivery time for less urgent shipments.
EMS (Express Mail Service): A more affordable option for non-urgent deliveries, with broad international coverage, though it may take longer compared to other services.
What is the maximum number of logic elements in the 1SX280HN2F43E2LG?
The device offers 2.8 million logic elements, making it suitable for large, compute-intensive applications.
What kind of memory is integrated in the 1SX280HN2F43E2LG?
It comes equipped with HBM2 (High Bandwidth Memory) and an additional 229 Mb of embedded memory for fast data access.
What industries commonly use this FPGA?
The 1SX280HN2F43E2LG is widely adopted in telecommunications, data centers, AI/ML applications, and high-performance computing.
What is the operating temperature range of this FPGA?
It operates in a wide temperature range of -40°C to +100°C, making it suitable for industrial and outdoor environments.
What packaging does the 1SX280HN2F43E2LG use?
The FPGA is housed in a 43mm x 43mm FCBGA package, designed for efficient heat dissipation and compact integration.
ML22Q625-NNNTBZ0BX | SPEECH SYNTHESIS LSI FOR CONSUME | ML22Q625-NNNTBZ0BX.pdf | ||
CMX7011Q3 | IC VOICE PROCESSOR 48VQFN | CMX7011Q3.pdf | ||
TDA7419TR | IC AUDIO SIGNAL PROCESSOR 28SO | TDA7419TR.pdf | ||
M61545FP#TF0R | 2-CHANNEL ELECTRONIC VOLUME | M61545FP#TF0R.pdf | ||
BD37531FV-E2 | IC AUDIO TONE PROCESSOR 28SSOPB | BD37531FV-E2.pdf | ||
TCM320AC39CPT | CONSUMER CIRCUIT, PQFP48 | TCM320AC39CPT.pdf | ||
SRC4190IDB | IC SAMPLE RATE CONVERTER 28SSOP | SRC4190IDB.pdf | ||
SRC4190IDBRQ1 | IC SAMPLE RATE CONVERTER 28SSOP | SRC4190IDBRQ1.pdf | ||
MAX98932DEV# | DEVELOPMENT | MAX98932DEV#.pdf | ||
ZXCZA200JC40TA | IC INTEGRATED CIRCUIT | ZXCZA200JC40TA.pdf | ||
CS3318K-CQZ | IC 8-CHANNEL DIGITAL VOLUME CONT | CS3318K-CQZ.pdf | ||
FSA8039AUMSX | AUDIO JACK INTERFACE SOLUTION W/ | FSA8039AUMSX.pdf |