Intel
DescriptionIntel
PackageTray
Stock6000
PriceActive
DownloadThe 1SX280HU3F50E2VG is part of the Intel® Stratix® 10 family, designed for advanced high-performance computing applications. This FPGA (Field Programmable Gate Array) provides industry-leading performance and density, combining HyperFlex™ architecture with a heterogeneous 3D System-in-Package (SiP). The 1SX280HU3F50E2VG offers superior computational power for tasks such as machine learning, data analytics, and telecommunications. With extensive logic resources, high-speed transceivers, and integrated processors, it enables cutting-edge performance in modern applications requiring flexibility and scalability.
HyperFlex™ Architecture: Enhances clock frequency performance by reducing critical path delays, delivering significant gains in computational tasks.
High Performance: Supports up to 28 Gbps transceivers and massive logic and memory resources for data-intensive applications.
3D System-in-Package (SiP) Technology: Provides scalability and flexibility, integrating multiple dies within a single package to increase functionality and capacity.
Advanced Security Features: Includes features such as secure device manager and encryption, ensuring data integrity and secure operation in critical applications.
Heterogeneous Computing Support: Integrates ARM® Cortex®-A53 processors for versatile, multi-core operations in complex, compute-heavy tasks.
Parameter | Value |
---|---|
Family | Stratix® 10 |
Logic Elements | 2,800,000 |
Embedded Memory | 229 Mbits |
Transceiver Speed | Up to 28 Gbps |
Core Voltage | 0.8 V |
Operating Temperature | 0°C to 100°C |
Package / Case | 1517-FCBGA |
Number of I/Os | 624 |
Process Technology | 14nm FinFET |
Integrated Processors | Dual ARM® Cortex®-A53 |
Power Consumption | Optimized for energy-efficient operations |
PCI Express Support | Yes, Gen 3 |
The 1SX280HU3F50E2VG is ideal for various applications where high performance, scalability, and flexibility are essential. It is widely used in:
Telecommunications Infrastructure: High-speed transceivers and robust data handling capabilities make this FPGA a key component in 5G base stations, network routers, and switching systems.
Data Centers and Cloud Computing: The device supports high-performance computing (HPC) and large-scale data processing tasks with its extensive logic resources and parallel processing capabilities.
Machine Learning and AI: Ideal for implementing deep learning algorithms and real-time data processing in artificial intelligence systems and neural networks.
Aerospace and Defense: Suitable for complex, mission-critical systems requiring reliable and secure computational power, such as radar systems and signal intelligence.
Video Processing: Used in advanced video and image processing applications, supporting high-throughput data transmission and low-latency operations for live broadcast and surveillance systems.
5G Network Deployment: The 1SX280HU3F50E2VG can handle the heavy data loads and signal processing required for 5G telecommunications equipment, ensuring low-latency communication and high throughput.
High-Performance Computing: Deployed in data centers for tasks like real-time data analytics, high-speed trading algorithms, and cloud-based AI inference models.
Autonomous Vehicle Systems: Supports the compute-intensive workloads needed for sensor fusion, real-time decision-making, and advanced driver-assistance systems (ADAS) in autonomous vehicles.
Medical Imaging Systems: Utilized in MRI and CT scanning systems where rapid and accurate data processing is critical for image generation and analysis.
DHL Express: Known for fast and reliable delivery, typically taking 1-3 business days for international shipments. Ideal for urgent deliveries.
FedEx International Priority: Offers reliable 1-3 day shipping with detailed tracking, suitable for time-sensitive deliveries.
UPS Worldwide Express: Provides 2-5 day shipping with a balance of speed and cost, preferred for less time-critical but important shipments.
Sea Freight: Best for bulk shipments with a focus on cost-efficiency, but delivery can take several weeks depending on the destination.
Air Freight: Combines the speed of air travel with the capacity to handle large shipments, making it suitable for large-scale orders needing quicker delivery times than sea freight.
What is the maximum transceiver speed for the 1SX280HU3F50E2VG?
The FPGA supports transceivers with speeds of up to 28 Gbps, making it suitable for high-speed data communication applications.
What makes HyperFlex™ architecture unique?
HyperFlex™ architecture reduces critical path delays, enabling higher performance in timing-critical tasks by providing more flexibility in routing and clock management.
What is the operating temperature range for this FPGA?
The 1SX280HU3F50E2VG operates reliably in temperatures ranging from 0°C to 100°C, making it suitable for use in a wide variety of environments.
What applications can benefit most from the ARM® Cortex®-A53 processors integrated into the FPGA?
The dual ARM® Cortex®-A53 processors are highly useful in applications requiring both general-purpose processing and custom hardware acceleration, such as embedded systems, AI, and machine learning applications.
CMX7158Q3 | IC AUDIO SIGNAL PROCESS 48VQFN | CMX7158Q3.pdf | ||
M82359-12 | ACCESS VOICE PROCESSOR | M82359-12.pdf | ||
R3910-CFAB-E1B | IC AUDIO SIGNAL PROCESSOR 25SIP | R3910-CFAB-E1B.pdf | ||
LC75106V-TLM-H | IC AUDIO SIGNAL PROCESSOR 36SSOP | LC75106V-TLM-H.pdf | ||
LV3313PM-MPB-E | 4CH CAR ELECTRONIC VOLUME | LV3313PM-MPB-E.pdf | ||
SB3231-E1-T | IC AUDIO SIGNAL PROCESSOR 25SIP | SB3231-E1-T.pdf | ||
FSA8029UMX | AUDIO JACK SEND / END DETECTION | FSA8029UMX.pdf | ||
TPA5050RSAT | IC AUDIO SIGNAL PROCESSOR 16QFN | TPA5050RSAT.pdf | ||
TCM320AC39IDW | CONSUMER CIRCUIT, PDSO20 | TCM320AC39IDW.pdf | ||
BD37542FS-E2 | IC AUDIO TONE PROCESSOR 32SSOPA | BD37542FS-E2.pdf | ||
TDA7448 | IC VOLUME CONTROL 20SO | TDA7448.pdf | ||
LA75676VA-TLM-E-ON | IF SIGNAL PROCESSOR (VIF + SIF) | LA75676VA-TLM-E-ON.pdf |