1SX280HH1F55E1VGS3

1SX280HH1F55E1VGS3
Manufacturer

Intel

Description

Intel

Package

Tray

Stock

6000

Price

Active

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1SX280HH1F55E1VGS3.pdf

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Product Attributes

1SX280HH1F55E1VGS3 Product Details

Product Overview

The 1SX280HH1F55E1VGS3 is part of Intel's Stratix 10 FPGA family, offering cutting-edge performance and advanced features for demanding applications. It leverages Intel’s HyperFlex™ architecture to deliver high bandwidth, low latency, and energy-efficient processing. With up to 2.8 million logic elements and numerous high-speed transceivers, the device is ideal for applications requiring massive parallelism, such as data centers, high-performance computing (HPC), and 5G wireless infrastructure. Its extensive configurability and integration capabilities make it a preferred choice for developers aiming for scalable, high-performance solutions.

Key Features and Advantages

  • HyperFlex™ Architecture: Delivers up to 2x the core performance over previous generations, enhancing throughput and processing efficiency.

  • High Logic Density: With 2.8 million logic elements, it supports complex designs and computational workloads.

  • High-Speed Transceivers: Supports data rates up to 58 Gbps, enabling fast communication for high-bandwidth applications like 5G, data centers, and high-speed networking.

  • Integrated HBM (High-Bandwidth Memory): Provides up to 512 GB/s memory bandwidth for data-intensive tasks.

  • Energy Efficiency: Optimized for low-power operation, making it suitable for energy-sensitive environments.

  • Advanced Security Features: Includes built-in encryption and secure boot functionality to safeguard sensitive data and prevent unauthorized access.

  • Scalability: Supports scalable architecture for seamless integration in diverse applications such as artificial intelligence (AI), machine learning (ML), and video processing.

Product Specifications

ParameterValue
CategoryEmbedded - FPGAs (Field Programmable Gate Arrays)
FamilyStratix 10
Logic Elements (LE)2.8 Million
Embedded Memory229 Mb
Transceivers96
Transceiver SpeedUp to 58 Gbps
High-Bandwidth Memory (HBM)Up to 512 GB/s
Operating Voltage0.85V Core Voltage
Maximum Power Consumption300W
SecurityAES-256 Encryption, Secure Boot
Operating Temperature0°C to 100°C
Package / CaseFCBGA-1517
Process Technology14 nm FinFET
ApplicationsData Centers, 5G, HPC, AI, ML, Networking

Applications

The 1SX280HH1F55E1VGS3 is versatile and can be deployed across a wide range of industries and high-performance applications:

  • Data Centers: It supports high-performance computing tasks and massive data throughput, ideal for storage and server systems in data centers.

  • 5G Wireless Infrastructure: Used in 5G base stations and core network equipment for processing high-speed data, supporting multiple connections simultaneously.

  • Artificial Intelligence (AI) and Machine Learning (ML): Provides the computational power needed for training and deploying complex models in real-time, making it essential for AI/ML accelerators.

  • High-Performance Computing (HPC): Suitable for scientific simulations, financial modeling, and other computationally intensive workloads.

  • Video Processing and Broadcasting: Offers low-latency and high-throughput capabilities for video encoding, streaming, and broadcasting applications.


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Usage Scenarios

  • Data Center Acceleration: The 1SX280HH1F55E1VGS3 is commonly deployed as an FPGA accelerator for data processing, offloading CPU-intensive tasks to improve overall system performance.

  • Telecommunications: In the telecommunications sector, this FPGA plays a crucial role in 5G networks by handling massive amounts of data with low latency, enabling faster and more reliable mobile communication.

  • AI/ML Development: The device is ideal for AI training and inference, offering the performance and scalability required to handle complex neural networks and large datasets.

  • Video Transcoding: Supports real-time video encoding and transcoding, a key requirement in broadcasting, streaming, and digital content creation industries.

  • High-Speed Networking: In networking applications, its high-speed transceivers and scalable architecture enable the efficient management of high bandwidth for routers, switches, and other communication devices.

Shipping and Logistics

Common international shipping methods for electronic components include:

  • DHL Express: Fast and reliable shipping, typically delivering within 1-3 business days. It offers advanced tracking and is known for its efficiency in customs clearance.

  • FedEx International Priority: Ideal for time-sensitive shipments, FedEx offers delivery in 2-4 business days with a comprehensive tracking system.

  • UPS Worldwide Express: Provides a balance between speed and cost, with delivery times of 2-5 business days. It's known for its extensive global network and reliable service.

  • TNT Express: Well-suited for European routes, TNT provides a cost-effective solution with a slightly longer delivery time, usually between 3-6 business days.

  • EMS (Express Mail Service): An economical option for international shipping with delivery times ranging from 5-15 business days, EMS is slower but offers reasonable tracking options.


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FAQs

  1. What are the primary applications for the 1SX280HH1F55E1VGS3?
    It is widely used in data centers, 5G infrastructure, AI/ML systems, HPC, and video processing industries.

  2. What makes the 1SX280HH1F55E1VGS3 energy-efficient?
    It utilizes Intel’s HyperFlex™ architecture and optimized power consumption design, which reduces energy usage while maintaining high performance.

  3. Does this FPGA support high-bandwidth applications?
    Yes, it features up to 96 transceivers with speeds up to 58 Gbps and integrated HBM, providing up to 512 GB/s of memory bandwidth.

  4. What type of security features are included?
    The 1SX280HH1F55E1VGS3 includes AES-256 encryption and secure boot features to ensure data security and integrity.

  5. What package is the 1SX280HH1F55E1VGS3 available in?
    It comes in an FCBGA-1517 package, optimized for performance and heat dissipation in demanding environments.


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